Occupation · SOC 51-9141
Semiconductor Processing Technicians
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
Median wage
$51,180
$35,980–$87,190
Projected growth
+11.0%
Faster than average
Annual openings
350
per year
Employed (US)
32,150
Job Zone 2
Typical preparation
Some preparation
Stackable credential programs
118 mapped
Core skills
Operations MonitoringCritical ThinkingReading ComprehensionActive ListeningMonitoringQuality Control Analysis
Knowledge areas
Production and ProcessingEnglish LanguagePublic Safety and SecurityComputers and ElectronicsEducation and Training
Technology & tools
Industrial control softwareData base user interface and query softwareSpreadsheet softwareOffice suite softwarePresentation software
Representative tasks
Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.Maintain processing, production, and inspection information and reports.Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.Load and unload equipment chambers and transport finished product to storage or to area for further processing.Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.Load semiconductor material into furnace.Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.Count, sort, and weigh processed items.Calculate etching time based on thickness of material to be removed from wafers or crystals.Inspect equipment for leaks, diagnose malfunctions, and request repairs.Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.Stamp, etch, or scribe identifying information on finished component according to specifications.Scribe or separate wafers into dice.Connect reactor to computer, using hand tools and power tools.Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.
Competency framework
Skill expectations by proficiency level.
emerging
Control panel switches and buttons — activate under direct supervision to initiate basic semiconductor processing cycles in a cleanroom environment.Work orders and processing charts — read and interpret to identify operation sequences and specifications under technician guidance on the production floor.Semiconductor wafers — place into processing containers using vacuum wands or tweezers following step-by-step instructions in a supervised fab setting.Chemical cleaning baths and blow-off wands — operate under close direction to clean semiconductor wafers according to standard facility protocols.Surface defects on wafers and components — recognize and flag using a microscope and standard visual inspection procedures with supervisor support.Processing logs and inspection records — enter data accurately into spreadsheet software following prescribed formats under direct oversight.Equipment chambers — load and unload finished wafers and transport product to designated storage areas under guidance from senior technicians.Rinsing solutions and bath containers — replace and clean according to posted procedures to maintain basic equipment readiness in the work area.Personal protective equipment and cleanroom gowning protocols — follow consistently to meet public safety and contamination-control requirements.Verbal and written instructions from senior staff — listen actively and read carefully to confirm correct task sequence before beginning processing steps.
developing
Processing cycle parameters — monitor via industrial control software during production runs and report deviations to the appropriate technician with minimal prompting.Precision measuring instruments and electronic test equipment — apply routinely to measure circuitry dimensions and verify components against specification tolerances.Wafer handling tools including vacuum wands and tweezers — use with consistent arm-hand steadiness and finger dexterity to transfer wafers without defect or contamination.Production and inspection reports — compile and update in database or spreadsheet software on a shift basis to maintain accurate processing records.Chemical bath concentrations and etching solutions — replace and verify at scheduled intervals using established procedures to sustain equipment performance.Standard processing formulas and operation sequences — interpret independently from work orders and route sheets to set up equipment for multiple process steps.Automatic wafer cleaning equipment — operate and adjust settings for routine cleaning cycles, troubleshooting minor issues using deductive reasoning and operator manuals.Quality control checks on in-process wafers — perform systematically using microscopy and test instruments, distinguishing acceptable variation from true defects.Equipment chamber load and unload sequences — execute in correct order across multiple tool types, coordinating multilimb actions to maintain throughput targets.Shift handoff notes and process deviation logs — document clearly in word processing or office suite software so incoming staff can continue production without interruption.
proficient
Full semiconductor process flow — execute autonomously across cleaning, inspection, loading, and cycling steps, applying critical thinking to resolve non-routine equipment or product issues.Electronic test equipment and precision instruments — select, calibrate, and apply independently to perform comprehensive circuitry and dimensional verification across diverse wafer types.Process anomalies and out-of-spec conditions — identify root causes using inductive and deductive reasoning, then implement corrective actions to restore yield within established guidelines.Industrial control software and ERP systems — query, update, and cross-reference to track lot status, materials consumption, and equipment scheduling across the production line.Chemical cleaning processes — optimize bath chemistry, cycle times, and equipment settings based on product requirements and quality data trends without supervisory direction.Inspection and quality analysis data — analyze across multiple production lots using analytical or scientific software to detect systematic defect patterns and recommend process adjustments.Work instructions, formulas, and safety data sheets — synthesize written technical content with precision to configure multi-step operations accurately in a regulated fab environment.Equipment preventive maintenance tasks — perform and document independently, including solution changeovers, container cleaning, and component checks, reducing unplanned downtime.Junior technicians and new hires — guide informally on correct wafer handling, control panel operation, and cleanroom protocols during day-to-day production activities.Cross-functional process information — communicate clearly in written reports and verbal briefings to engineers and supervisors, enabling informed decisions on process changes.
advanced
Semiconductor processing competency standards — develop and implement across the technician team to elevate consistent quality and throughput performance at the facility level.Process control parameters and equipment configurations — establish best-practice baselines using production data analysis, setting the standard for all shift teams in the fab.On-the-job training curricula and structured procedures — design using knowledge of production processes, chemistry, and electronics to accelerate new technician qualification.Quality control analysis frameworks — lead implementation of systematic inspection and measurement protocols that reduce defect rates and improve yield across multiple product lines.ERP and industrial control software capabilities — champion adoption and optimization at the department level, ensuring technicians leverage technology for accurate lot tracking and reporting.Safety and contamination-control programs — own and continuously improve, integrating public safety regulations and chemistry handling requirements into daily operating standards.Production bottlenecks and systemic process failures — diagnose at the organizational level using comprehensive operations monitoring and critical thinking, directing corrective strategies.Cross-departmental collaboration with process engineers and quality teams — lead, translating technician-level observations into actionable data that drives process engineering decisions.Performance metrics and processing efficiency goals — set and track for the technician workforce, using achievement orientation and perseverance to drive continuous improvement culture.Succession and skills-gap planning for the semiconductor processing team — conduct by assessing individual competency levels and aligning training resources to long-term production capacity needs.
Also known as
128 alternate job titles map to this occupation.
Chemical Etch OperatorGroup Level ProcessorDevelopmental Engineer, Trainer (Air Force 62E4Q)Wafer Fabrication OperatorManufacturing TechnicianProbe OperatorDevelopmental Engineer, RPA (Air Force 62E1M)Wafer MounterDevelopmental Engineer, C2ISREW (Air Force 62E3Z)Ion Implant Machine OperatorDevelopmental Engineer, Bomber (Air Force 62E3R)Semiconductor Dies LoaderDevelopmental Engineer, Tanker (Air Force 62E1S)Developmental Engineer, Flight Test (Air Force 62E3F)Test Technician, Semiconductor Processing EquipmentDevelopmental Engineer, General (Air Force 62E1W)Semiconductor Packages SealerDevelopmental Engineer, Systems/Industrial/Human Factors (Air Force 62E3I)Diffusion Furnace Operator, Semiconductor WafersSemiconductor Wafers StripperDevelopmental Engineer, RPA (Air Force 62E3M)Integrated Circuit FabricatorDevelopmental Engineer, Tanker (Air Force 62E4S)Crystal GrowerDevelopmental Engineer, RPA (Air Force 62E4M)Small Group Level ProcessorSemiconductor AssemblerWafer Machine OperatorSaw Operator, Semiconductor WafersDevelopmental Engineer, Computer Systems (Air Force 62E3C)Developmental Engineer, Fighter (Air Force 62E4P)Developmental Engineer, ABM (Air Force 62E1N)Lap Machine TenderDevelopmental Engineer, Helicopter or EWO (Air Force 62E3V)Developmental Engineer, Helicopter or EWO (Air Force 62E4V)Developmental Engineer, Systems/Industrial/Human Factors (Air Force 62E1I)Wafer Polishing WorkerEpitaxial Reactor OperatorCrystal SlicerSemiconductors Metallization Equipment Tender